Microfabrication

Spincoater	Photolithography	Wetbench
SPS Spin150 Spincoater SPS Spin150 Pieces, 4'', 6'' max. 10 krpm	OAI Hybralign 400 OAI Hybralign 400 Pieces, 4''	Wetbench Lotus Systems
Metal deposition	Parylene	Wirebonder
Moorfield Minilab Evaporator/Sputterer Moorfield Minilab Pieces, 4'' 3 thermal sources 1 DC sputtering source	SCS PDS2010 SCS PDS2010 Parylene C	Wirebonder TPT deep access bonder
Plasma cleaner	Reactive Ion Etcher
Diener Electronic Femto, 13.56 MHz Diener Electronic Femto, 13.56 MHz Pieces, 4''	South Bay Technology RIE2000 South Bay Technology RIE2000 Pieces, 4'', 6'' O2, CF4

External equipment

• Deep silicon etching (DRIE)
• Reactive Ion Etching and ion milling
• Chemical Vapor Deposition (PECVD and LPCVD)
• Physical Vapor Deposition (ebeam, sputtering)
• Oxidation
• Wafer bonding (anodic, fusion)
• Chemical Mechanical Polishing (CMP)
• Focused Ion Beam

Microscopy

Upright microscopes

• Zeiss Axioscope.A1 (BF, DF, DIC, Fluorescence)
• Nikon E600 (BF, Phase, Fluorescence)
• Carl Zeiss Jena materials microscope

Inverted microscopes

• Zeiss Axio Observer.Dm1 (BF, DF, DIC, Fluorescence)
• Nikon Ti-E (BF, Phase, Fluorescence)
• Motic AE31

CCD

• Andor Clara
• Andor DSD (white light confocal)
• Andor Neo sCMOS
• Casio Exilim F1

Wetlab

• Nanodrop 3300 Fluorimeter
• Nanodrop 2000c UV-Vis Spectrophotometer
• Agilent 1100
• Standard equipment