Microfabrication
Spincoater
|
Photolithography
|
Wetbench
|
SPS Spin150 Spincoater SPS Spin150 Pieces, 4'', 6'' max. 10 krpm |
OAI Hybralign 400 OAI Hybralign 400 Pieces, 4'' |
Wetbench Lotus Systems |
Metal deposition
|
Parylene
|
Wirebonder
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Moorfield Minilab Evaporator/Sputterer Moorfield Minilab Pieces, 4'' 3 thermal sources 1 DC sputtering source |
SCS PDS2010 SCS PDS2010 Parylene C |
Wirebonder TPT deep access bonder |
Plasma cleaner
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Reactive Ion Etcher
|
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Diener Electronic Femto, 13.56 MHz Diener Electronic Femto, 13.56 MHz Pieces, 4'' |
South Bay Technology RIE2000 South Bay Technology RIE2000 Pieces, 4'', 6'' O2, CF4 |
External equipment
- Deep silicon etching (DRIE)
- Reactive Ion Etching and ion milling
- Chemical Vapor Deposition (PECVD and LPCVD)
- Physical Vapor Deposition (ebeam, sputtering)
- Oxidation
- Wafer bonding (anodic, fusion)
- Chemical Mechanical Polishing (CMP)
- Focused Ion Beam
Microscopy
Electron microscopy
- Phenom G3 desktop SEM with EDX
Upright microscopes
- Zeiss Axioscope.A1 (BF, DF, DIC, Fluorescence)
- Nikon E600 (BF, Phase, Fluorescence)
- Carl Zeiss Jena materials microscope
Inverted microscopes
- Zeiss Axio Observer.Dm1 (BF, DF, DIC, Fluorescence)
- Nikon Ti-E (BF, Phase, Fluorescence)
- Motic AE31
CCD
- Andor Clara
- Andor DSD (white light confocal)
- Andor Neo sCMOS
- Casio Exilim F1
Wetlab
- Nanodrop 3300 Fluorimeter
- Nanodrop 2000c UV-Vis Spectrophotometer
- Agilent 1100
- Standard equipment